Back Semiconductor Application- FITOK ALD Series Atomic Layer Deposition Diaphragm Valves
Introduction
Atomic Layer Deposition (ALD) is a method of applying thin films to various substrates with atomic scale precision. As chip node dimensions are continuously shrinking, traditional deposition techniques have reached their limits. Depositing ultra-thin layer at the nanoscale requires Atomic Layer Deposition (ALD) technology, which allows materials to be deposited one atomic layer at a time. ALD series diaphragm valves are used to deliver precise doses of gases during the deposition process used to create semiconductor chips.
Features
- Ultrahigh cycle life with high-speed actuation
- Quick response capable of valve opening or closing time of less than 5 ms
- Thermal actuator extends the life in applications where the body is heated
- Contained seat to provide excellent resistance to swelling and contamination
- Elgiloy diaphragm to provide high strength and corrosion resistance to ensure long cycle life
- High-purity grade PFA seat with broad range of chemical compatibility
- Minimum particle generation and dead space facilitate purging
- Valves with inductive sensors, solenoid valve assemblies, heater cartridge and thermocouple holes are available
Technical Data
Application
Suitable for atomic layer deposition (ALD) processes in the following semiconductor fields
- High-K dielectrics and metal gate
- MEMS
- Optoelectronic materials and devices
- Integrated circuit interconnect line diffusion barrier
- Flat panel display (organic light emitting diode material, OLED)
- Optical element
- Solar cell
- Various types of films (<100 nm)
Please see the product catalog for more information. Should you have any questions, please contact us directly or contact your nearest authorized distributor.