Back Semiconductor Application- FITOK ALD Series Atomic Layer Deposition Diaphragm Valves
Introduction
Atomic Layer Deposition (ALD) is a method of applying thin films to various substrates with atomic scale precision. As chip node dimensions are continuously shrinking, traditional deposition techniques have reached their limits. Depositing ultra-thin layer at the nanoscale requires Atomic Layer Deposition (ALD) technology, which allows materials to be deposited one atomic layer at a time. ALD series diaphragm valves are used to deliver precise doses of gases during the deposition process used to create semiconductor chips.
Features
- Ultra long cycle life
- No dead space in the flow path
- High Cv consistency and stability
- Quick response to offer a total opening / closing response time of less than 15 ms
- Standard and thermal types optional, the thermal type has a working temperature up to 392 °F (200 °C)
- For the valve fitted with a solenoid valve, the solenoid valve is circularly rotatable along the actuator for easy position adjustment
Technical Data
Application
Suitable for atomic layer deposition (ALD) processes in the following semiconductor fields
- High-K dielectrics and metal gate
- MEMS
- Optoelectronic materials and devices
- Integrated circuit interconnect line diffusion barrier
- Flat panel display (organic light emitting diode material, OLED)
- Optical element
- Solar cell
- Various types of films (<100 nm)
Please see the product catalog for more information. Should you have any questions, please contact us directly or contact your nearest authorized distributor.